I've managed to solder the BGA bluetooth module by putting it on a grill plate (basicaly used to grill meat, very high tech equipment ). There is absolutely no temperature control, but my test show that it works quite well. I had to deball some unused lead and cover them with insulating tape so they cannot interfere with the PCB track routed to the most internal balls of the array. I've set up a series of landmark on the PCB, and aligned the module. The the whole assembly is placed on the plate and power is applied. Once the temperature is sufficient the module start to collapse (and the capilarity help because il will self center the balls on the landig pads even if it is not perfeclty aligned). I then wait 5-6 sec and turn off power, and let it cool down slowly. Final testing is done by checking any shortcut between leads and by applying power and check the consumption. I've sucessfuly solder 4 modules yet (4 out of 4).
). There is absolutely no temperature control, but my test show that it works quite well. I had to deball some unused lead and cover them with insulating tape so they cannot interfere with the PCB track routed to the most internal balls of the array. I've set up a series of landmark on the PCB, and aligned the module. The the whole assembly is placed on the plate and power is applied. Once the temperature is sufficient the module start to collapse (and the capilarity help because il will self center the balls on the landig pads even if it is not perfeclty aligned). I then wait 5-6 sec and turn off power, and let it cool down slowly. Final testing is done by checking any shortcut between leads and by applying power and check the consumption. I've sucessfuly solder 4 modules yet (4 out of 4).
